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Mechanical Engineering Co-op (Summer/Fall 2020)


Rockwell Collins
Location: Cedar Rapids
Job type: Permanent
Sector: Manufacturing
Category: Engineers Jobs
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Mechanical Engineering Co-op (Summer/Fall 2020)
Business Unit Collins Aerospace
Req IDDate posted 10/14/City Cedar Rapids
State/Province Iowa
Country/Region United States

Date Posted:

:00

Country:

United States of America

Location:

HIA32: Cedar Rapids, IA 400 Collins Rd NE , Cedar Rapids, IA, USA

Collins Aerospace is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Created in 2018 by bringing together Rockwell Collins and UTC Aerospace Systems, Collins Aerospace has the capabilities, comprehensive portfolio and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market.

The Microelectronics Packaging team is seeking a highly motivated person to be a Mechanical Engineering Co-op within the Mission Systems Microelectronics Packaging Group. This group is responsible for the Microelectronics Packaging technology activities for Collins Aerospace.

As a Mechanical Engineering Co-op you will be involved in the design and development of microelectronics packaging and technologies. Responsibilities for this position will require involvement in a variety of microelectronics packaging efforts. These efforts include: Package design, technology/process development, prototype build & evaluation, qualification testing, failure analysis, factory transition, and manufacturing support.

The successful candidate must have good written and verbal skills, a willingness to learn and expand their technology base, and work well within a diverse team environment. Candidates should be of good standing in one of the following engineering fields: Mechanical, Material, Chemical or Industrial.

Experience / knowledge in the following technical areas are desired:

* Microelectronics design and manufacturing assembly

* Electronic component reliability testing
* Silicon wafer fabrication processes
* Failure analysis techniques
*

Working knowledge of Mechanical 3D CAD

*

Proficiency in MS Office products

Basic Qualifications:

* Must be pursuing a bachelor’s or master’s degree in a related field of study from an accredited institution
* Must have GPA of 3.0
* Must have completed 30 hours of college coursework
* US Citizenship required

At Collins, the paths we pave together lead to limitless possibility. And the bonds we form – with our customers and with each other -- propel us all higher, again and again.

and be part of the team that’s redefining aerospace, every day.

United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

Privacy Policy and Terms:
Note to candidates regarding interview scams: We'd like to make it clear that UTC Aerospace Systems never asks candidates for money. If you've been approached with a job offer that you suspect may be fraudulent, we strongly recommend you do not respond, send money or personal information. Please report any suspicious activity to Talent Acquisition.
Mechanical Engineering Co-op (Summer/Fall 2020)
Business Unit Collins Aerospace
Req IDDate posted 10/14/City Cedar Rapids
State/Province Iowa
Country/Region United States

Date Posted:

:00

Country:

United States of America

Location:

HIA32: Cedar Rapids, IA 400 Collins Rd NE , Cedar Rapids, IA, USA

Collins Aerospace is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Created in 2018 by bringing together Rockwell Collins and UTC Aerospace Systems, Collins Aerospace has the capabilities, comprehensive portfolio and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market.

The Microelectronics Packaging team is seeking a highly motivated person to be a Mechanical Engineering Co-op within the Mission Systems Microelectronics Packaging Group. This group is responsible for the Microelectronics Packaging technology activities for Collins Aerospace.

As a Mechanical Engineering Co-op you will be involved in the design and development of microelectronics packaging and technologies. Responsibilities for this position will require involvement in a variety of microelectronics packaging efforts. These efforts include: Package design, technology/process development, prototype build & evaluation, qualification testing, failure analysis, factory transition, and manufacturing support.

The successful candidate must have good written and verbal skills, a willingness to learn and expand their technology base, and work well within a diverse team environment. Candidates should be of good standing in one of the following engineering fields: Mechanical, Material, Chemical or Industrial.

Experience / knowledge in the following technical areas are desired:

* Microelectronics design and manufacturing assembly

* Electronic component reliability testing
* Silicon wafer fabrication processes
* Failure analysis techniques
*

Working knowledge of Mechanical 3D CAD

*

Proficiency in MS Office products

Basic Qualifications:

* Must be pursuing a bachelor’s or master’s degree in a related field of study from an accredited institution
* Must have GPA of 3.0
* Must have completed 30 hours of college coursework
* US Citizenship required

At Collins, the paths we pave together lead to limitless possibility. And the bonds we form – with our customers and with each other -- propel us all higher, again and again.

and be part of the team that’s redefining aerospace, every day.

United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

Privacy Policy and Terms:
Note to candidates regarding interview scams: We'd like to make it clear that UTC Aerospace Systems never asks candidates for money. If you've been approached with a job offer that you suspect may be fraudulent, we strongly recommend you do not respond, send money or personal information. Please report any suspicious activity to Talent Acquisition.

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